Finishing Permukaan: Berlapis ni/au
Layar sutra: Putih, Hitam, Kuning
Bahan-bahan: Ventec, Politronik, Begquist
Ketebalan papan: 0,2-6,0mm
Ruang Garis Min: 8 juta
Pengolahan: Perhimpunan
Surface Mount Technology: Available
Vip Process: Yes
Thickness Of Copper: 0.5-14oz (18-490um)
Surface Finishing: HASL/OSP/ENIG
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min. Min. panel size ukuran panel: 50mmx50mm
Permukaan: Perendaman Emas
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Thickness Of Copper: 0.5-14oz (18-490um)
Pcb: Single,double,multilayer Pcb,custom Pcb
Min Trace: 3/3 juta
Ketebalan PCB: 1,6mm
Jalan-jalan yang Buta dan Terkubur: Tersedia
Ketebalan: 0,4-3,2mm
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