Sample: Avaliable
Thermal Conductivity: 0.5/1/2/3/5/8 W,1.0w,>=1.0W/mK
Layer Count: 2-16 Layers
Sample: Avaliable
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Blind Vias: Yes
Key Words: High Density Interconnector
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Impedance Control: +/-10%
Bga: 10MIL
Kontrol Impedansi: +/-10%
Kesalahan Perataan Lapisan: +/- 0.06
Sampel: Tersedia
Permukaan: Perendaman Emas
produk: Papan Sirkuit Cetak
Diameter Lubang Minimal: 0,10 mm
Berat Tembaga: 0,25OZ~12OZ
Diameter Lubang Minimal: 0,10 mm
Diameter Lubang Minimal: 0,10 mm
Min. Min. panel size ukuran panel: 50mmx50mm
Jumlah Lapisan: 16 Lapisan
Ketebalan: 0,6mm
Features: Gerber/PCB File Needed
Finished Copper: 1OZ
Thickness: 0.6mm
Size: 9*9cm
Fitur: Diperlukan Berkas Gerber/PCB
Jumlah Lapisan: 16 Lapisan
Ruang Garis Min: 8 juta
Pengolahan: Perhimpunan
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