Kontrol Impedansi: +/-10%
Kesalahan Perataan Lapisan: +/- 0.06
Impedance Control: +/-10%
Bga: 10MIL
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Blind Vias: Yes
Key Words: High Density Interconnector
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Surface Mount Technology: Available
Vip Process: Yes
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min Trace: 3/3 juta
Ketebalan PCB: 1,6mm
Jalan-jalan yang Buta dan Terkubur: Tersedia
Ketebalan: 0,4-3,2mm
Ketebalan: 0,4-3,2mm
Jalan-jalan yang Buta dan Terkubur: Tersedia
Jarak lapisan dalam: 0,15mm
Ketebalan: 0,4-3,2mm
Ukuran Lubang Terkecil: 0,1 mm
menit melalui: 0,1 mm
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