Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min Trace: 3/3 juta
Ketebalan PCB: 1,6mm
Jalan-jalan yang Buta dan Terkubur: Tersedia
Ketebalan: 0,4-3,2mm
Ketebalan: 0,4-3,2mm
Jalan-jalan yang Buta dan Terkubur: Tersedia
Jarak lapisan dalam: 0,15mm
Ketebalan: 0,4-3,2mm
Ukuran Lubang Terkecil: 0,1 mm
menit melalui: 0,1 mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Min. Min. panel size ukuran panel: 50mmx50mm
Permukaan: Perendaman Emas
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Base Material: Aluminum Base,CUSTOM
Withstand Voltage: >3KV
Withstand Voltage: >3KV
Base Material: Aluminum Base,CUSTOM
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