Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Finished Copper Thickness: 1oz
Silkscreen: White, Black, Yellow, Etc.
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
kata kunci: Interkonektor Kepadatan Tinggi
Pengujian: 100% Pengujian E, X-RAY
Ketebalan papan: 0,2mm-6,00 mm(8mil-126mil)
Ukuran lubang: 0.1mm Laser Drill
Ketebalan: 0,4-3,2mm
Persyaratan khusus: Soket Lampu
Min Trace: 3/3 juta
Lapisan Papan: 6-32L
Pengujian: 100% Pengujian E, X-RAY
Ketebalan: 0,4-3,2mm
Layer Count: 4-20 Layers
Testing: 100%E-Testing,X-RAY
Minimum Hole Size: 0.15mm
Pcb Name: 4L 1+N+1 HDI Boards
Impedance Control: Yes
Testing: 100%E-Testing,X-RAY
Key Words: High Density Interconnector
Ketebalan papan: 0,2mm-6,00 mm(8mil-126mil)
Rasio Aspek: 10:1
Raw Material: FR4 IT180
Lapisan Papan: 6-32L
Ukuran lubang: 0.1mm Laser Drill
Bahan baku: FR4 IT180
Ketebalan: 0,4-3,2mm
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