hdi printed circuit board (88) Online Produsen
kata kunci: Interkonektor Kepadatan Tinggi
Ketebalan papan: 0,2mm-6,00 mm(8mil-126mil)
Bahan baku: FR4 IT180
Kontrol Impedansi: Ya.
Key Words: High Density Interconnector
Ketebalan papan: 0,2mm-6,00 mm(8mil-126mil)
Pengujian: 100% Pengujian E, X-RAY
Ketebalan: 0,4-3,2mm
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Ukuran lubang: 0.1mm Laser Drill
Persyaratan khusus: Soket Lampu
Blind Vias: Yes
Key Words: High Density Interconnector
Jarak lapisan dalam: 0,15mm
Ketebalan: 0,4-3,2mm
Permintaan special: Setengah Lubang, 0,25mm BGA
Min Trace: 3/3 juta
Impedance Control: +/-10%
Bga: 10MIL
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Lapisan Papan: 6-32L
Pengujian: 100% Pengujian E, X-RAY
Min Trace: 3/3 juta
Lapisan Papan: 6-32L
Kontrol Impedansi: +/-10%
Kesalahan Perataan Lapisan: +/- 0.06
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
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