electronic circuit board (365) Online Produsen
Jumlah Lapisan: 2
Ukuran Lubang Min: 0,2 mm
Lapisan: 4-22 Lapisan
Pengemasan: Pengepakan Vakum Dengan Kotak Karton
Key Words: High Density Interconnector
Ketebalan papan: 0,2mm-6,00 mm(8mil-126mil)
Min Trace: 3/3 juta
Lapisan Papan: 6-32L
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Bga: 10MIL
Jarak lapisan dalam: 0,15mm
Ketebalan: 0,4-3,2mm
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Surface Mount Technology: Available
Vip Process: Yes
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Persyaratan khusus: Impedansi multikelas
Layanan: OEM Layanan Satu Atap
Ukuran: /
Ketebalan Tembaga: 0,5OZ-6OZ
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Surface: OSP
Copper: 1oz
Epoxy kaca: RO4730G3 0,762 mm
konstanta dielektrik: 2.55-10.2
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